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VS6451
Ultra small reflowable CIF+ camera module
Data Brief
Features

CIF+ resolution sensor (384x320 or 320x384)
Z Height - See table 1
Electrical and logical interface fully SMIA compliant Video data interface - CCP2.0 Command interface - CCI 2.8 V/1.8 V operation On-board 10-bit ADC Small physical size Integral EMC shielding Ultra low power standby mode On-chip PLL Lead free reflowable module
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The module design is optimized to provide an ultra small footprint and height, and is designed to be reflowable at lead-free solder profiles. The product is lead free. The lens design is optimized for video conferencing and maintains its performance even after the high temperatures of lead-free reflow. VS6451 offers an ultra low power consumption hardware standby mode consuming less than 30 W.
Description
This VS6451 is an ultra small reflowable CIF+ camera module for use across a range of mobile phone handsets and accessories. It is primarily designed to be used as a second camera in video conferencing applications, but it may also be used as a primary camera. The camera sensor is SMIA class 2 profile 0 compliant and is capable of generating raw bayer CIF+ images up to 30 fps. The VS6451 supports the CCI control and CCP2.0 data interfaces. As different phone platforms have different baseband processors with varying capabilities, it may not be possible for all phones to support the associated image processing algorithms. Where the baseband cannot support this processing load, a separate hardware accelerator (STV0976 or STV0984) device can be incorporated in the phone system to run the algorithms in hardware. The STV0984 processor can support 2 cameras. The specifications of these devices are contained in a separate document.
Applications

Mobile phone PDA Videophone
Order code
Part number VS6451R0BA/T2 Package Lead-free reflowable module
April 2006
Rev 1
1/5
www.st.com
5
For further information contact your local STMicroelectronics sales office.
VS6451
Figure 1.
Application diagram
Figure 2.
Block diagram
VS6451 CIF+ Mobile Camera Module
STV0984 CLK or PDN STV0976 Processor CCI CCP2.0
CLK PDN I2C CCP2.0 or ITU
Baseband or Application Processor
EXTCLK XSHUTDOWN
VS6451
PLL and Clock Management Power Mgmt CCI Receiver Sensor Control Registers Power-On Reset CIF+ Pixel array 1152 x 864 VDIG DGND
Readout
CCI CCP2.0
SMIA Rx'er
CLKP CLKN DATAP DATAN
CCP2.0 Transmitter
VS6451 CIF+ Mobile Camera Module
CLK PDN
Baseband or Application Processor
SCL SDA
SMIA profile 0 frame formatter
Y Decoder
VANA AGND
Column ADC X Decoder Line SRAM
Table 1.
Technical specifications
Parameter Values CIF+ portrait and landscape 0.18 m HCMOS8i shrink 3.6m x 3.6m +8 dB +24 dB (max) 61 dB 34 dB (@ 100 lux) < 7lux Analogue: 2.4V to 2.9V Digital: 1.8V 0.1V <60 mW 4.5 mm x 4.5 mm x 3.6 mm 45+/- 2 (CIF+, CIF equiv. 45) 2.8 On axis 45% (typ) Horizontal field (70%) 25% (typical) <|5%| 60% (typ) Lead free reflowable BGA [-40; +85]C [-30; +70]C [-25; +55]C [+5; +30]C
Pixel array Sensor technology Pixel size Exposure control Analogue gain Dynamic range Signal to noise Minimum illumination Supply voltage Average power consumption @ 30fps Module size (XYZ) max Lens HFOV F number Lens SFR Lens TV distortion Relative illumination System connectivity Storage temperature Functional operating temperature Normal operating temperature Optimal operating temperature
2/5
VS6451 Figure 3. Mechanical data
4.50 0.10
2.00, note 2
3
4.50 0.10
3.12 0.10
C Z Height - See table 1 B
PART CODE SENSOR RESOLUTION VS6451ROBA CIF+ (384 X 320)
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TABLE 1 PLATING SPECIFICATION
2.54 - 5.08 microns tin over Nickel strike (shield can)
Z HEIGHT 3.60 +/-0.10 after soldering (0.10 paste thickness)
3/5
Revision history
VS6451
Revision history
Table 2.
Date 26-Apr-2006
Document revision history
Revision 1 Initial release. Changes
4/5
VS6451
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